Production technological parameters: Production technological parameters

| Parametr | Process limit value | |
|---|---|---|
| 1. | Maximum customer format – double sided PCBs | 560 x 360 mm |
| 2. | Maximum customer format – single sided PCBs | 570 x 370 mm |
| 3. | Minimum distance between conductor and board edge | 0,5 mm |
| 4. | Minimum distance between tracks | 0,15 mm |
| 5. | Minimum track width | 0,15 mm |
| 6. | Minimum annular ring width (radius) | 0,2 mm |
| 7. | Minimum diameter of plated hole | 0,3 mm |
| 8. | Minimum diameter of unplated hole | 0,4 mm |
| 9. | Permissible offset between copper layer and drilling | 0,15 mm |
| 10. | Permissible offset between solder resist and copper layer | 0,1 mm |
| 11. | Permissible offset between legend and drilling | 0,3 mm |
| 12. | Permissible offset peelable mask and drilling | 0,3 mm |
| 13. | Permissible offset carbon paste and drilling | 0,3 mm |
| 14. | Maximum permissible spread of laminate thickness (with copper foil, without plating, solder resist and tining) | ±14 % |
| 15. | Unplated holes diameter tolerance from 0,4 to 1,0mm | + 0.05 – 0.05mm |
| 16. | Unplated holes diameter tolerance from 1,05 to 4,0mm | + 0.10 – 0.05 mm |
| 17. | Unplated holes diameter tolerance more than 4,0mm | + 0.15 – 0.05 mm |
| 18. | Plated holes diameter tolerance from 0,3 to 1,0mm | + 0.10 – 0.05 mm |
| 19. | Plated holes diameter tolerance from 1,05 to 5,0mm | + 0.10 – 0.10 mm |
| 20 | Plated holes diameter tolerance more than 5,0mm | + 0.15 – 0.10 mm |
| 21. | External dimensions tolerances of scored PCBs (after split) | – 0.01 mm – + 0.30 mm |
| 22. | Scoring line width (laminate thichness 1,55 mm) | <= 0.6 mm |
| 23. | Scoring line relative position to nominal position shift | ± 0.2 mm |
| 24. | Upper and lower scoring line shift | ± 0.1 mm |
| 25. | Milled dimensions tolerances | ± 0.20 mm |
| 26. | Minimum distance between milling and conductor | 0.30 mm |
| 27. | Solder resist thickness on copper | od 8 do 45 um |
| 28. | HASL tin thickness | od 1 do 40 um |
| 29. | ENIG gold and nickel thickness | Au od 0,05 do 0,125μmNi od 3,0 do 10μm |
| 30. | Maximum hole diameter for stable peelable mask covering (bigger than 2,0mm on demand, losses complements client) | 2.0 mm |
| Except above mentioned parameters during PCB inspection we follow IPC-A-600 standard. | ||
ATTENSION: Exceptions from the parameters given in the document, including reduction of tolerances, are possible after confirmation by Engineering Department.